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MediaTekhas denote the Dimensity 9200 as its new flagship mainframe , which will power the next generation of flagshipsmartphones . The Dimensity 9000 serial is MediaTek ’s line of flagship processor . Announced last year , it includes theDimensity 9000 and the Dimensity 9000 Plus . The two chipsets are competitor to Qualcomm ’s Snapdragon 8 Gen 1 and Snapdragon 8 + Gen 1 .
Qualcomm may have its chipsets in a wider range of mathematical product than Qualcomm , but MediaTek is keeping it on its toes . ItsDimensity 9000 central processor best the Snapdragon 8 Gen 1 , and that struggle is expected to extend with this new generation processor . Although MediaTek has announced its own flagship processor for 2022 first , Qualcomm wo n’t be far behind as the Snapdragon 8 Gen 2 chipset is scheduled for launching at the Snapdragon Summit set about on Nov. 15 .
The Dimensity 9200 is a 4 nm chipset built by TSMC , and it has eight CPU cores in a 1 + 3 + 4 contour . The prime core is the Cortex - X3 , and it is clocked at 3.05GHz . MediaTeksays it is the first chip to feature the Cortex - X3 with an operating hurrying over 3GHz There are also three Cortex - A715 functioning gist clocked at 2.85GHz and four Cortex - A510 power efficiency marrow time at 1.8GHz . MediaTek ’s new chipset also features ARM ’s new Immortalis - G715 GPU , which has a hardware - free-base ray - tracing engine . In addition , the chipmaker ’s signature HyperEngine gaming technology is also present in its sixth - genesis phase for quick and immersive play .
May Appear In Foldables Too
moreover , the Dimensity 9200 ’s Imagiq 890 image signal processor should ameliorate photos as it natively supports RGBW sensor . MediaTek says sound power by its chipset will be able to avoid Bayer spiritual rebirth and furnish up to 34 percent more power delivery than rival chipsets . There is also a new AI Processing Unit ( APU ) which is 35 percentage faster than the fifth - propagation APU . Another interesting lineament is support for Wi - Fi 7 . This makes the Dimensity 9200 the first Wi - Fi 7 - ready chipset on the market . And eventually , the Dimensity 9200 launches withsupport for sub-6GHz and mmWave 5 guanine , which is good news for those who reside in the U.S. The specification sheet also bring up reinforcement for LPDDR5X RAM , UFS 4.0 , and Bluetooth LE Audio .
MediaTek sound out the Dimensity 9200 will power the next generation of smartphones which will " follow in a smorgasbord of fashionable and foldable form factors . " The last part of the statement is interesting , as a MediaTek processor is yet to appear in a foldable smartphone even though this category of gimmick is already in its fourth year . All of Samsung ’s foldaway smartphones are power by Qualcomm ’s Snapdragon processors . The same applies to all the other mark that have launch folding smartphones , such as Motorola , Xiaomi , Oppo , and Vivo . The only exception is Huawei , whose Mate X andMate Xs foldable smartphoneslaunched with Kirin C.P.U. .
While it is not have a bun in the oven to see Samsung drop Qualcomm for MediaTek for its next - gen foldable smartphones , the first MediaTek - power foldable smartphone will likely be announced by a Chinese manufacturer . Mediatekhas revealed that the first Dimensity 9200 - powered smartphones will hit market shelf by the end of 2022 , but it is obscure if they will be from Oppo , Asus , Xiaomi , or Vivo , as all of them have affirm to have phones powered by the chipset in development .
Source : MediaTek
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